[1]Yubo Guo, Huiping Yu, Yanpeng Gong, Fei Qin. Thermal analysis of IGBT by isogeometric boundary element method[C]. Proceedings of the 21st International Conference on Electronic Packaging Technology (ICEPT 2020), Guangzhou, China, Aug. 2020. (EI20204309396677)
[2] Bensong Pi, Huiping Yu, Pei Chen, Fei Qin.Thermal conductivity of epoxy resin using molecular dynamics simulation. ICEPT 2018:995-999
[3] Shichao Yuan, Huiping Yu, Ming Xian, Fei Qin. Simulation research on wafer warpage and internal stress in the First Passivation process of eSiFO package. ICEPT 2018:990-994
[4] Yue Yuan, Huiping Yu. QFN cutting temperature measurement basing on the infrared thermal imager. ICEPT 2017: 1073-1077
[5] Huiping Yu, Mingqing Hu. Analysis the interface delamination of Cu and EMC adhesive material in the cutting process of electronic chip based on cohesive zone modeling. ICEPT 2016: 943-946
[6] Huiping Yu, Feng Feng.Numerical Analysis and Parameter Optimization of Thermal Stress Effect for Low-K Layer Flip-Chip with Copper Pillar Bumping. ICEPT 2015
[7] HuiPing Yu, MingQing Hu.The Experimental study of Quenched and Unhardened Boron B1500HS.2014 International Conference on Mechanics and Materials Engineering: 722-726
