已在国际力学领域和集成电路封装领域权威期刊发表SCI论文70余篇，其中第一作者/通讯作者SCI论文40余篇。部分代表性的期刊论文如下：
[1]Chen ZY,Dai YW*, Liu YH*. Crack propagation simulation and overload fatigue life prediction via enhanced physics-informed neural networks. International Journal of Fatigue, 2024, 186, 108382.
[2]Kong WC,Dai YW*, Liu YH*, Out-of-plane effect on the sharp V-notch tip fields in power-law creeping solids: A three-dimensional asymptotic analysis, International Journal of Solids and Structures, 2022, 236–237, 111352.
[3]Dai YW, Qin F, Liu YH, Chao YJ. On the second order term asymptotic solution for sharp V-notch tip field in elasto-viscoplastic solids.International Journal of Solids and Structures, 2021, 217–218, 106-122.
[4]Zhao S,Dai YW*, Qin F*, Li Y, Liu L, Zan Z, An T, Chen P, Gong Y, Wang Y, On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters, Materials Science and Engineering A, 2021, 823, 141729.
[5]Dai YW, Liu YH, Qin F, Chao YJ, Chen HF. Constraint modified time dependent failure assessment diagram (TDFAD) based on C(t)-A2(t) theory for creep crack. International Journal of Mechanical Sciences, 2020, 165, 105193.
[6]Dai YW, Liu YH, Qin F, Chao YJ, Berto F. Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint. International Journal of Solids and Structures, 2019, 180-181, 189-204.
[7]Dai YW, Liu YH, Chao YJ. Higher order asymptotic analysis of crack tip fields under mode II creeping conditions. InternationalJournal of Solids and Structures, 2017, 125, 89-107.
[8]Dai YW, Liu DH, Liu YH. Mismatch constraint effect of creep crack with modified boundary layer model. Journal of Applied Mechanics-Transactions of the ASME,2016, 83(3), 031008.
